Canteliver Probe Card
MPI Cantilever Probe Card is greatly utilized on gold bump and pad wafer tests for Show driver, logic, and memory product. MPI’s cantilever probes are classified as the corresponding respond to towards the needs of fine pitch, smaller pad size, higher pace, fewer cleansing, multi-DUT, high pin count, and ultra-reduced leakage needs. With outstanding craftsmanship, impressive architecture and established methodologies dependant on mechanical and electrical simulation/measurement results, creating MPI the very best cantilever supplier around the globe.
FCB Probe Card
The FCB Probe Card is easily the most experienced know-how of buckling beam probe card. It is actually aimed to realize the semiconductor ship manufacture time-to-market place (TTM) and value of examination (COT) need. FCB is actually a verified Remedy for a number of semiconductor manufacturing tests from early engineering pilot-operates to significant volume manufacturing (HVM). FCB is prepared for product necessitating large signal integrity probing (SI) and/or ability integrity probing (PI). Apps incorporate reducing-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and more. FCB assures the earth’s greatest General cost-of-possession (COO) for numerous DUT purposes.
EVS Probe Card
The EVS Probe Card is undoubtedly an enhancement around the traditional buckling beam probe card. Crucial features are better existing carrying capacity (C.C.C.) and decreased balanced Get hold of force (BCF), and All round MEMS-like characteristics. EVS can easily fulfill the prerequisite of Sophisticated wafer probing. Exact alignment and excellent planarity Management would be the critical elements contributing to steady contact resistance. With its capability and general performance, EVS Probe Card is a great option for Sophisticated probe cards.
Osprey probe card
The Osprey probe card is MPI’s Alternative to demand for ever finer pitch. It can be suitable for smaller sized Al pad, and is also perfect for very small pitch application with peripheral and total array pattern. With exact alignment and improved planarity control, Osprey can achieve better efficiency by multi-DUT design. The forming wire (FW) kind needle developed with MPI’s individual micro fabrication process not only delivers higher-top quality functionality and also will allow easy needle replacement and shortens maintaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle which is designed for the demand of low drive probing. Additionally, it comes with the chance to satisfy high C.C.C. and high pin counts software. The MEMS website system makes sure remarkably reliable needle features, along with the Particular construction style enables specific alignment and planarity Management.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/